Protective film substance for laser processing and method of processing workpiece
AssigneeDisco Corporation
InventorsSenichi Ryo, Yuki Ikeda, Yukinobu Ohura, Toshiyuki Yoshikawa
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Abstract
A protective film substance for laser processing includes a solution including a water-soluble resin, an organic solvent, and a light absorbent. The solution has an absorbance, i.e., an absorbance converted for a solution diluted 200 times, equal to 0.05 or more per an optical path length of 1 cm at a wavelength of 532 nm. Alternatively, the protective film substance for laser processing includes a solution including a water-soluble resin, an organic solvent, and a polyhydroxyanthraquinone derivative.
Claims11
A method of processing a workpiece which has a functional layer with a plurality of devices, comprising:
- a protective film preparing step of preparing a protective film substance by preparing a solution including a water-soluble resin, an organic solvent, and a light absorbent;
- a dilution step of forming a diluted protective film substance by diluting the protective film substance 200 times with water;
- a measurement step of measuring an absorbance of the diluted protective film substance, such that an absorbance of the diluted protective film substance is equal to 0.05 or more per an optical path length of 1 cm at a wavelength of 532 nm;
- a protective film forming step of forming a protective film covering a surface of the functional layer with the plurality of devices to be processed of the workpiece by coating the surface of the functional layer with the plurality of devices with the protective film substance for laser processing;
- and
- a processing step of processing the workpiece by applying a laser beam having a wavelength absorbable by the workpiece and the protective film to the workpiece through the protective film.
Dependencies are inferred from the claim text.