Enclosure structure, electronic device, and enclosure structure preparation method

An enclosure structure of an electronic device, comprising:

• an enclosure, comprising a non-metal part made of a non-metal material, wherein the non-metal part has a first surface and a second surface that are opposite to each other, wherein the first surface faces an exterior of an electronic device, wherein the second surface faces an interior of the electronic device, a first area is formed on the second surface, and a second area is an area other than the first area on the second surface;
• an antenna grain line, wherein the antenna grain line is located in the first area and is connected;
• and
• an auxiliary grain line, wherein the auxiliary grain line is located in the second area and is disconnected,
• wherein the antenna grain line and the auxiliary grain line each comprise, in a direction away from the enclosure, a transition layer, a conductive layer, and a corrosion-resistant layer that are disposed in a stacked manner.

An electronic device, comprising:

• an enclosure structure comprising:
• an enclosure, a non-metal part made of a non-metal material, wherein the non-metal part has a first surface and a second surface that are opposite to each other, wherein the first surface faces an exterior of the electronic device, and wherein the second surface faces an interior of the electronic device;
• and
• an antenna grain line disposed on the first surface;
• or
• a groove disposed on the second surface, wherein the antenna grain line is disposed in the groove,
• wherein the antenna grain line comprises, in a direction away from the enclosure, a transition layer, a conductive layer, and a corrosion-resistant layer that are disposed in a stacked manner;
• and
• a circuit board, disposed inside the electronic device, wherein an antenna transceiver module and a first signal line connected to the antenna transceiver module are disposed on the circuit board, and wherein the first signal line is electrically connected to the antenna grain line.

An enclosure structure preparation method, comprising:

• disposing an antenna grain line on a first surface, wherein an enclosure structure comprises an enclosure, the enclosure comprises a non-metal part made of a non-metal material, wherein the non-metal part has the first surface and a second surface that are opposite to each other, wherein the first surface faces an exterior of an electronic device, and wherein the second surface faces an interior of the electronic device;
• or
• disposing a groove on the second surface, and disposing the antenna grain line in the groove,
• wherein the disposing the antenna grain line comprises:
• disposing, in a direction away from the enclosure, a transition layer, a conductive layer, and a corrosion-resistant layer in a stacked manner, to form the antenna grain line.

A method for preparing an enclosure structure, comprising:

• dividing a second surface into a first area and a second area, wherein the first area is an area other than the second area on the second surface, wherein the enclosure structure comprises an enclosure, wherein the enclosure comprises a non-metal part made of a non-metal material, wherein the non-metal part has a first surface and the second surface that are opposite to each other, wherein the first surface faces an exterior of an electronic device, and wherein the second surface faces an interior of the electronic device;
• disposing an antenna grain line in the first area, wherein the antenna grain line is connected;
• and
• disposing an auxiliary grain line in the second area, wherein the auxiliary grain line is disconnected,
• wherein disposing the antenna grain line and disposing the auxiliary grain line comprises:
• disposing, in a direction away from the enclosure, a transition layer, a conductive layer, and a corrosion-resistant layer in a stacked manner, to form the antenna grain line and the auxiliary grain line.