Substrate processing apparatus and cleaning method

A cleaning method for cleaning a substrate processing apparatus,

• wherein the substrate processing apparatus includes:
• a processing chamber;
• a rotatable substrate support configured to hold a substrate in the processing chamber;
• a freezing device that is configured to cool the substrate support;
• a first mechanism configured to selectively raise and selectively lower the freezing device, wherein the first mechanism can raise the freezing device such that the freezing device makes physical contact with the substrate support, and wherein the first mechanism can lower the freezing device such that the freezing device is not in physical contact with the substrate support;
• a second mechanism configured to rotate the substrate support, wherein the substrate support is configured to be rotated by the second mechanism while the freezing device is not in physical contact with the substrate support;
• a power supply part configured to supply radio frequency (RF) power;
• and
• a power supply line that extends from the power supply part to a contact portion and penetrates through the freezing device, wherein the contact portion can be moved with the freezing part by the first mechanism, wherein the contact portion is configured to be able to deliver RF power from the power supply part when the contact portion is in physical contact with the substrate support at a contacting position, and wherein the first mechanism can lower the freezing part and the contact portion such that the contact portion is not in physical contact with the substrate support,
• the cleaning method comprises:
• cooling the substrate support by bringing the freezing device into contact with the substrate support using the first mechanism;
• and
• cleaning the processing chamber by connecting the contact portion to the contacting position and supplying RF power from the power supply line to the substrate support.