Movable device and wound capacitor package structure thereof

A wound capacitor package structure, comprising:

• a wound assembly;
• a conductive assembly including a first conductive pin electrically contacting the wound assembly and a second conductive pin electrically contacting the wound assembly;
• a package assembly configured to enclose the wound assembly;
• and
• a bottom seat plate disposed on a bottom side of the package assembly for carrying the package assembly;
• wherein both a first exposed portion of the first conductive pin and a second exposed portion of the second conductive pin pass through the bottom seat plate and are partially exposed from a bottom side of the bottom seat plate;
• wherein the bottom seat plate has a first through opening and a first bottom guide channel communicated with the first through opening, and the first exposed portion of the first conductive pin passes through the first through opening and extends along the first bottom guide channel;
• wherein the bottom seat plate has a second through opening and a second bottom guide channel communicated with the second through opening, and the second exposed portion of the second conductive pin passes through the second through opening and extends along the second bottom guide channel;
• wherein a first gap defined between the first exposed portion of the first conductive pin and an inner surface of the first bottom guide channel of the bottom seat plate ranges from 0.01 mm to 0.2 mm, a bottom side of the first exposed portion of the first conductive pin is exposed from the first bottom guide channel of the bottom seat plate, and a first exposed height defined from the bottom side of the first exposed portion to the bottom side of the bottom seat plate ranges from 0.01 mm to 0.3 mm;
• wherein a second gap defined between the second exposed portion of the second conductive pin and an inner surface of the second bottom guide channel of the bottom seat plate ranges from 0.01 mm to 0.2 mm, a bottom side of the second exposed portion of the second conductive pin is exposed from the second bottom guide channel of the bottom seat plate, and a second exposed height defined from the bottom side of the second exposed portion to the bottom side of the bottom seat plate ranges from 0.01 mm to 0.3 mm.

A movable device configured to use a wound capacitor package structure, the wound capacitor package structure comprising a wound assembly, a conductive assembly, a package assembly and a bottom seat plate;

• wherein the conductive assembly includes a first conductive pin electrically contacting the wound assembly and a second conductive pin electrically contacting the wound assembly, the package assembly is configured to enclose the wound assembly, and the bottom seat plate is disposed on a bottom side of the package assembly for carrying the package assembly;
• wherein both a first exposed portion of the first conductive pin and a second exposed portion of the second conductive pin pass through the bottom seat plate and are partially exposed from a bottom side of the bottom seat plate;
• wherein the bottom seat plate has a first through opening and a first bottom guide channel communicated with the first through opening, and the first exposed portion of the first conductive pin passes through the first through opening and extends along the first bottom guide channel;
• wherein the bottom seat plate has a second through opening and a second bottom guide channel communicated with the second through opening, and the second exposed portion of the second conductive pin passes through the second through opening and extends along the second bottom guide channel;
• wherein a first gap defined between the first exposed portion of the first conductive pin and an inner surface of the first bottom guide channel of the bottom seat plate ranges from 0.01 mm to 0.2 mm, a bottom side of the first exposed portion of the first conductive pin is exposed from the first bottom guide channel of the bottom seat plate, and a first exposed height defined from the bottom side of the first exposed portion to the bottom side of the bottom seat plate ranges from 0.01 mm to 0.3 mm;
• wherein a second gap defined between the second exposed portion of the second conductive pin and an inner surface of the second bottom guide channel of the bottom seat plate ranges from 0.01 mm to 0.2 mm, a bottom side of the second exposed portion of the second conductive pin is exposed from the second bottom guide channel of the bottom seat plate, and a second exposed height defined from the bottom side of the second exposed portion to the bottom side of the bottom seat plate ranges from 0.01 mm to 0.3 mm.