Multi-layered metal frame power package

An electronics assembly comprising:

• a plurality of metal traces that define electrically isolated conductive paths between a top level and a bottom level of a multilevel conductive wiring network;
• and
• a microchip attached and electrically coupled to the top level of the multilevel conductive wiring network,
• wherein:
• a first cavity is defined through the top level of the multilevel conductive wiring network, and
• a second cavity is defined through the bottom level of the multilevel conductive wiring network.

A method for manufacturing an electronics assembly, comprising:

• (a) depositing and patterning a first photoresist layer on a first side of a first planar conductive sheet in a plurality of planar conductive sheets;
• (b) depositing and patterning a second photoresist layer on a second side of the first planar conductive sheet;
• (c) etching the first and second sides of the first planar conductive sheet according to patterns in the first and second photoresist layers to form electrically isolated conductive traces;
• (d) repeating steps (a)-(c) for each additional planar conductive sheet in the planar conductive sheets;
• (e) aligning the planar conductive sheets using alignment marks in the planar conductive sheets;
• and
• (f) attaching and electrically coupling neighboring planar conductive sheets to form a multilevel wiring structure that includes electrically isolated conductive paths between a bottom level and a top level of the multilevel wiring structure.

An electronics assembly comprising:

• a plurality of planar conductive metal sheets comprising:
• a first conductive metal sheet;
• a second conductive metal sheet attached and electrically coupled to the first metal sheet;
• and
• a third conductive metal sheet attached and electrically coupled to the second metal sheet, the second metal sheet located between the first and third conductive metal sheets,
• wherein:
• at least first and second electrically isolated conductive paths are defined through the planar conductive metal sheets in a multilevel conductive wiring network, and
• one or more spaces between the first and second electrically isolated conductive paths is/are filled with a ferromagnetic-polymer composite material.

An electronics assembly comprising:

• a plurality of planar conductive metal sheets, each planar conductive metal sheet attached and electrically coupled to at least one neighboring planar conductive metal sheet;
• a multilevel conductive wiring network defined in the planar conductive metal sheets, the planar conductive metal sheets including one or more spaces that define, at least in part, one or more electrically isolated conductive paths through each planar conductive metal sheet;
• and
• a ferromagnetic-polymer composite material disposed in at least each space.