Smart IC substrate, smart IC module, and IC card including the same

A smart IC module comprising:

• a smart IC substrate;
• and
• a chip disposed on the smart IC substrate,
• wherein the smart IC substrate comprises:
• a substrate including one surface and an other surface;
• a circuit pattern and a connection circuit pattern disposed on the one surface;
• and
• a coil pattern part disposed on the other surface, wherein the coil pattern part includes a coil pattern, a first terminal provided at an inner end of the coil pattern, and a second terminal provided at an outer end of the coil pattern,
• wherein the chip is disposed on the other surface of the substrate,
• wherein the substrate includes a first region disposed inside the coil pattern and a second region disposed outside the coil pattern,
• wherein the first terminal is disposed in the first region, and the second terminal is disposed in the second region,
• wherein a first via hole is formed in the first region of the substrate corresponding to the circuit pattern,
• wherein a second via hole is formed in the second region of the substrate and overlapping the second terminal and the connection circuit pattern along a vertical direction,
• wherein a third via hole is formed in the first region of the substrate corresponding to the connection circuit pattern,
• wherein a connection member is disposed inside the second via hole and includes a conductive paste, and
• wherein a first surface of the connection member is in direct connection with the second terminal, and a second surface of the connection member, opposite to the first surface, is in direct connection with the connection circuit pattern.