US 12,530,013 B2 · Digital twin modeling of IC packaging structure

Abstract

Various embodiments are directed to analysis of three-dimensional structure of an integrated circuit (IC) sample in order to enable sample preparation for physical inspection and hardware assurance. Specifically, various embodiments provide a structural analysis framework that enables high-quality sample preparation, including careful material removal of IC packaging material without damaging internal components of the IC sample. In various embodiments, the structural analysis framework involves receiving a digital twin model of an IC sample, and the digital twin model may be generated using X-ray CT imaging. Then, various regions of interest of the IC sample may be identified and selected via the digital twin model. The structural analysis framework further includes performing THz-TDS to collect ultra-high-resolution thickness information at the regions of interest. Both the digital twin model and the ultra-high-resolution thickness information may then be used to guide material removal of the IC sample.

Claims15

Dependent claims

A method for analyzing a three-dimensional structure of an integrated circuit (IC) sample, the method comprising:

performing, using one or more imaging modalities, a preview scan of the IC sample to identify a plurality of features of the IC sample;
determining, based on the plurality of features of the IC sample, whether a similar design of the IC sample exists in a data store indicating that the similar design of the IC sample has been previously inspected;
responsive to determining that a similar design of the IC sample does not exist in the data store, generating a digital twin model for the IC sample, wherein the digital twin model comprises data characterizing an internal structure of the IC sample, wherein the data is collected in a non-destructive manner;
receiving an indication of one or more regions of interest of the digital twin model;
generating thickness information specific to each region of interest using near-field terahertz-time-domain-spectroscopy (THz-TDS) data collection that is different from the preview scan;
supplementing the digital twin model with the thickness information specific to each region of interest;
and
performing automatic sample preparation of the IC sample using the supplemented digital twin model.

5 more elements

A system for analyzing a three-dimensional structure of an integrated circuit (IC) sample, the system comprising one or more processors, a memory, and one or more programs stored in the memory, the one or more programs comprising instructions configured to:

perform, using one or more imaging modalities, a preview scan of the IC sample to identify a plurality of features of the IC sample;
determine, based on the plurality of features of the IC sample, whether a similar design of the IC sample exists in a data store indicating that the similar design of the IC sample has been previously inspected;
responsive to determining that a similar design of the IC sample does not exist in the data store, generate a digital twin model for the IC sample, wherein the digital twin model comprises data characterizing an internal structure of the IC sample, wherein the data is collected in a non-destructive manner;
receive an indication of one or more regions of interest of the digital twin model;
generate thickness information specific to each region of interest using near-field terahertz-time-domain-spectroscopy (THz-TDS) data collection that is different from the preview scan;
supplement the digital twin model with the thickness information specific to each region of interest;
and
perform automatic sample preparation of the IC sample using the supplemented digital twin model.

5 more elements

A computer program product for analyzing a three-dimensional structure of an integrated circuit (IC) sample, the computer program product comprising at least one non-transitory computer-readable storage medium having program instructions embodied thereon, the program instructions executable by a processor to cause the processor to:

perform, using one or more imaging modalities, a preview scan of the IC sample to identify a plurality of features of the IC sample;
determine, based on the plurality of features of the IC sample, whether a similar design of the IC sample exists in a data store indicating that the similar design of the IC sample has been previously inspected;
responsive to determining that a similar design of the IC sample does not exist in the data store, generate a digital twin model for the IC sample, wherein the digital twin model comprises data characterizing an internal structure of the IC sample, wherein the data is collected in a non-destructive manner;
receive an indication of one or more regions of interest of the digital twin model;
generate thickness information specific to each region of interest using near-field terahertz-time-domain-spectroscopy (THz-TDS) data collection that is different from the preview scan;
supplement the digital twin model with the thickness information specific to each region of interest;
and
perform automatic sample preparation of the IC sample using the supplemented digital twin model.

5 more elements

Dependencies are inferred from the claim text.

Digital twin modeling of IC packaging structure

Life of this patent

Digital twin modeling of IC packaging structure

Life of this patent

Abstract

Claims15