Apparatus for treating substrate including interference alleviation unit

An apparatus for treating a substrate, the apparatus comprising:

• a first process chamber having a first treating space therein;
• a second process chamber having a second treating space therein;
• and
• an exhaust unit configured to exhaust atmospheres of the first treating space and the second treating space,
• wherein the exhaust unit includes
• an integrated exhaust line in which a pressure reduction unit is installed,
• a first exhaust line configured to connect the first process chamber and a first point of the integrated exhaust line, a second exhaust line configured to connect the second process chamber and a second point of the integrated exhaust line, and
• an interference alleviation unit configured to alleviate exhaust interference between the first process chamber and the second process chamber, wherein the interference alleviation unit includes a discharge unit between the first point to which the first exhaust line is connected and the second point to which the second exhaust line is connected in the integrated exhaust line and configured to discharge some of air flow in the integrated exhaust line to outside of the integrated exhaust line, and wherein the discharge unit includes
• a first discharge unit adjacent to the first point of the first exhaust line, and
• a second discharge unit adjacent to the second point of the second exhaust line.

An apparatus for treating a substrate, the apparatus comprising:

• a first process chamber having a first treating space;
• a second process chamber having a second treating space;
• a transfer robot configured to transfer the substrate to the first process chamber or the second process chamber;
• and
• an exhaust unit configured to exhaust atmospheres of the first treating space and the second treating space,
• wherein the first process chamber includes
• a first treating container configured to provide the first treating space,
• a first support unit configured to support and rotate the substrate in the first treating space;
• and
• a first developing liquid supply unit configured to supply a developing liquid onto the substrate,
• the second process chamber includes
• a second treating container configured to provide the second treating space,
• a second support unit configured to support and rotate the substrate in the second treating space, and
• a second developing liquid supply unit configured to supply the developing liquid onto the substrate,
• the exhaust unit includes
• an integrated exhaust line in which a pressure reduction unit is installed,
• a first exhaust line connecting the first process chamber and a first point of the integrated exhaust line,
• a second exhaust line connecting the second process chamber and a second point of the integrated exhaust line, and
• an interference alleviation unit configured to alleviate exhaust interference between the first process chamber and the second process chamber by some of an air flow in the integrated exhaust line to outside of the integrated exhaust line through an opening in the integrated exhaust line, and
• the interference alleviation unit is between the first point to which the first exhaust line is connected and the second point to which the second exhaust line is connected in the integrated exhaust line.