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AssigneeDaikin Industries, Ltd.
InventorsYasukazu Nakatani, Shichou Chin, Toshio Miyatani, Hirotake Imada, Yukari Honda
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Provided is a film forming method that can form a film having a thickness of 500 μm or more with a single coating of a substrate. The present disclosure is a film forming method using a powder coating material containing a polyphenylene sulfide resin, the method including heating the powder coating material at a temperature equal to or higher than a melting point of the polyphenylene sulfide resin and within a range of 250 to 400° C., in which a single coating of a substrate forms a film having a thickness of 500 μm or more; and the obtained film has a surface roughness, Ra, of 0.30 μm or less.
A polyphenylene sulfide powder coating material being able to form a film having a thickness of 500 μm or more and a surface roughness, Ra, of 0.30 μm or less by a single coating of a metal substrate under a condition of heating at a temperature within a range of 250 to 400° C. and equal to or higher than a melting point of a polyphenylene sulfide resin, wherein
A polyphenylene sulfide powder coating material, comprising a polyphenylene sulfide resin having an MFR of 10 to 100 g/10 min,
Dependencies are inferred from the claim text.