Ink-jet adhesive, method for producing electronic component, and electronic component

An ink-jet adhesive comprising:

• a photocurable compound having a (meth) acryloyl group or a vinyl group and having no cyclic ether group;
• a photopolymerization initiator;
• and
• optionally, a thermosetting compound having no (meth) acryloyl group and having a cyclic ether group,
• wherein, if the thermosetting compound is present, the ink-jet adhesive comprises the thermosetting compound in an amount of 5 wt % or less, and
• wherein, when the ink jet adhesive is irradiated with light having an integrated light amount of 1000 mJ/cm2 so that illuminance at a wavelength of 365 nm is 100 mW/cm2 to obtain a B staged adhesive X, an elastic modulus of the B-staged adhesive X at 25° C. is 1×105 Pa or more and 2×109 Pa or less.