Epoxy compound, composition prepared therefrom, semiconductor device prepared therefrom, electronic device prepared therefrom, article prepared therefrom, and method of preparing epoxy compound
AssigneeSamsung Electronics Co., Ltd.
InventorsChangho Noh, Insu Lee, Songwon Hyun, Yoonseok Ko, Mijeong Kim, Keechang Lee, Sangsoo Jee
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