Manufacturing method of electronic device
AssigneeInnolux Corporation
InventorsWan-Ling Huang, Chun-Hsien Lin, Yi-An Chen, Tsau-Hua Hsieh
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Abstract
A manufacturing method includes providing a first substrate including a circuit layer and an electronic element disposed on the circuit layer, providing a second substrate, bonding the first substrate and the second substrate to form an electronic module, cutting the electronic module, forming a wire on a first surface exposed after cutting the electronic module and on a second surface of the electronic module, wherein the first surface is adjacent to the second surface and the wire is electrically connected to the circuit layer, and disposing a driving element on the second surface of the electronic module to be electrically connected to the wire.
Claims8
A manufacturing method of an electronic device, comprising:
- providing a first substrate, wherein the first substrate includes a circuit layer and an electronic element disposed on the circuit layer;
- providing a second substrate;
- bonding the first substrate and the second substrate to form an electronic module;
- cutting the electronic module;
- forming a wire on a first surface which is exposed after cutting the electronic module and on a second surface of the electronic module, wherein the first surface is adjacent to the second surface, and the wire is electrically connected to the circuit layer;
- and
- disposing a driving element on the second surface of the electronic module to be electrically connected to the wire.
Dependencies are inferred from the claim text.