Bypass diode assembly for a photovoltaic module and method for fabricating

A photovoltaic module comprising a plurality of photovoltaic cells electrically connected in series and further comprising at least one bypass diode assembly, wherein the diode of the at least one bypass diode assembly is electrically connected in parallel to one or more of the plurality of photovoltaic cells, and wherein the at least one bypass diode assembly comprises:

• an electrically insulating tape extending in a longitudinal direction, the electrically insulating tape having a front side and a back side;
• a first electrically conductive ribbon attached to the electrically insulating tape and oriented parallel to the longitudinal direction, wherein the first electrically conductive ribbon extends over the back side of the electrically insulating tape at least between a first location and a second location spaced apart over a predetermined distance in the longitudinal direction and at least partially overlaps the first location and the second location, and wherein the first electrically conductive ribbon is locally exposed at the front side through an opening in the electrically insulation tape at the first location, wherein:
• the bypass diode assembly comprises a semiconductor component positioned in a through hole through the electrically insulating tape at the second location, wherein the semiconductor component comprises:
• a diode having a first diode terminal and a second diode terminal,
• a first contact pad in electrical contact with the first electrically conductive ribbon and electrically connected to the first diode terminal, and
• a second contact pad electrically connected the second diode terminal,
• the bypass diode assembly further comprises an electrically conductive ribbon portion on the front side of the electrically insulating tape and overlapping the semiconductor component, wherein the electrically conductive ribbon portion is in electrical contact with the second contact pad of the semiconductor component and wherein the electrically conductive ribbon portion is electrically isolated from the first electrically conductive ribbon by the electrically insulating tape.

A method for fabricating a bypass diode assembly, the method comprises:

• providing an electrically insulating tape extending in a longitudinal direction and having a front side and a back side;
• making an opening in the electrically insulating tape at at least one first location of the electrically insulating tape;
• making a through hole through the electrically insulating tape at at least one second location spaced apart over a predetermined distance from the at least one first location along the longitudinal direction;
• afterwards forming a tape arrangement by providing a first electrically conductive ribbon oriented parallel to the longitudinal direction of the electrically insulating tape, on the back side thereof, the first electrically conductive ribbon extending at least between a first location and a second location and at least partially overlapping the first location and the second location, the first electrically conductive ribbon being locally exposed at the front side through the opening at the first location;
• placing the tape arrangement on a support surface, with the front side of the electrically insulating tape facing away from the support surface, so that an open cavity is created at the location of the through hole, wherein at least part of a bottom of the open cavity is formed by the first electrically conductive ribbon;
• positioning a semiconductor component in the through hole, the semiconductor component comprising a diode having a first diode terminal and a second diode terminal, a first contact pad electrically connected to the first diode terminal and a second contact pad electrically connected to the second diode terminal, wherein the first contact pad is provided in physical contact with the first electrically conductive ribbon at the bottom of the open cavity;
• placing an electrically conductive ribbon portion on the front side of the electrically insulating tape, wherein the electrically conductive ribbon portion overlaps the semiconductor component, wherein the electrically conductive ribbon portion is in physical contact with the second contact pad of the semiconductor component, and wherein the electrically conductive ribbon portion is electrically isolated from the first electrically conductive ribbon by the electrically insulating tape;
• and
• forming an electrical connection between the first contact pad and the first electrically conductive ribbon and forming an electrical connection between the second contact pad and the electrically conductive ribbon portion by soldering or welding.