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US 12,526,958 B2Granted
Hybrid device cooling system
AssigneeQUALCOMM Incorporated
InventorsDhinesh Jambai Gopu, Thirukumaran Dechinamoorthy
Life of this patent
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Abstract
A device includes a heat source, a vapor chamber, a bridge, and a heat pipe. The vapor chamber is in thermal communication with the heat source and comprises a working fluid. The heat pipe is in thermal communication with a heatsink and in fluid communication via the bridge with the vapor chamber.
Claims30
A device comprising:
- a device structure, wherein the device structure includes a first edge, a second edge, and a third edge opposite the first edge;
- a heat source positioned between the first edge and the third edge;
- a vapor chamber in thermal communication with the heat source and comprising a working fluid;
- a bridge;
- a heat pipe in thermal communication with a heatsink and in fluid communication via the bridge with the vapor chamber;
- and
- a plurality of additional heat sources in thermal communication with the heat pipe, wherein the plurality of additional heat sources include a first additional heat source coupled to the first edge and the heat pipe, a second additional heat source coupled to the second edge and the heat pipe, and a third additional heat source coupled to the third edge and the heat pipe.
4 more elements
A device comprising:
- a device structure including a first edge, a second edge, and a third edge opposite the first edge;
- a heat pipe in thermal communication with a plurality of heat sources, wherein the plurality of heat sources include a first heat source coupled to the first edge and the heat pipe, a second heat source coupled to the second edge and the heat pipe, and a third heat source coupled to the third edge and the heat pipe;
- a bridge;
- and
- a vapor chamber comprising a working fluid and in fluid communication via the bridge with the heat pipe.
2 more elements
A method comprising:
- forming a vapor chamber configured to perform thermal management of a device, wherein the device includes a device structure having a first edge, a second edge, and a third edge opposite the first edge;
- forming a heat pipe, wherein the heat pipe is configured to be in thermal communication with a plurality of heat sources including a first heat source coupled to the first edge and the heat pipe, a second heat source coupled to the second edge and the heat pipe, and a third heat source coupled to the third edge and the heat pipe;
- forming a bridge between the vapor chamber and the heat pipe to enable fluid communication therebetween;
- and
- adding a working fluid into a volume defined by the vapor chamber, the heat pipe, and the bridge.
2 more elements
A method comprising:
- transporting heat from a heat source to a working fluid within a first heat exchange device;
- transporting the working fluid, via a bridge, to a second heat exchange device;
- and
- transporting heat from the working fluid within the second heat exchange device to a heatsink, wherein one of the first heat exchange device and the second heat exchange device is a vapor chamber and the other of the first heat exchange device and the second heat exchange device is a heat pipe, wherein the heat pipe is coupled to a device structure, wherein the device structure includes a first edge, a second edge, and a third edge opposite the first edge;
- wherein the heat pipe is thermally coupled to a plurality of additional heat sources;
- wherein the plurality of additional heat sources include a first additional heat source coupled to the first edge and the heat pipe, a second additional heat source coupled to the second edge and the heat pipe, and a third additional heat source coupled to the third edge and the heat pipe;
- and wherein the heat pipe is configured to provide cooling for a particular additional heat source at a higher temperature than a temperature of an ambient environment.
4 more elements
Dependencies are inferred from the claim text.