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US 12,526,926 B2Granted
Multi-pattern substrate, functional module, and production method for functional module
AssigneeCanon Kabushiki Kaisha
InventorMinoru Kambegawa
Life of this patent
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Abstract
A technique that improves productivity of a functional module on which a component is implemented near an edge. A multi-pattern substrate includes wiring substrate parts, and waste substrate parts provided around the wiring substrate parts integrally. And openings are provided in the waste substrate parts in areas that face components implemented near outer circumferences of the wiring substrate parts.
Claims4
A multi-pattern substrate comprising:
- wiring substrate parts;
- and
- waste substrate parts provided around the wiring substrate parts integrally,
- wherein openings are provided in the waste substrate parts in areas that face components implemented near outer circumferences of the wiring substrate parts, and
- wherein the components are inductor chips that form pattern antennas used for wireless communication.
2 more elements
Dependencies are inferred from the claim text.