Integrated circuit interconnects with integrated in-line capacitors
AssigneeMeta Platforms, Inc.
InventorPradip Sairam Pichumani
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Abstract
A system that includes improved integrated circuit interconnects integrated with interconnect capacitors that reduce noise and improve signal quality is disclosed. The system comprises a first circuit board layer including a contact region of a conductor trace. The system further comprises a second layer including an interconnect capacitor, wherein the interconnect capacitor comprises a first side coupled over at least a portion of the contact region of the first circuit board layer to form a contact pad on a second side of the interconnect capacitor configured to interface with an integrated circuit chip.
Claims8
A system, comprising:
- a first circuit board layer including a contact region of a conductor trace;
- and
- a second layer including a first interconnect capacitor and a second interconnect capacitor, wherein the first interconnect capacitor and second interconnect capacitor both comprise a first side configured to interface with the the first circuit board layer, and a second side configured to interface with an integrated circuit chip,
- wherein the first interconnect capacitor and second interconnect capacitor are integrated in-line with a solder bump interface to form an integrated circuit interconnect that connects the integrated circuit chip with the first circuit board layer, wherein the first interconnect capacitor, second interconnect capacitor, and the solder bump interface are arranged substantially in a line and
- wherein the second layer is coated over the first circuit board layer and between the first interconnect capacitor and the second interconnect capacitor except at least the contact region of the conductor trace of the first circuit board layer.
Dependencies are inferred from the claim text.