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US 12,526,000 B2Granted
Radio frequency transmission front-end module and associated manufacturing method
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsAyssar Serhan, Pascal Reynier, Alexandre Giry, Perceval Coudrain, Jean-Philippe Michel
Life of this patent
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Abstract
An integration system and method for the manufacture of radio frequency transmission front-end modules with radio frequency integrated circuit(s) and self-biased magnetic component(s) integrated on a “Wafer Level Packaging”-type technology. This integration makes it possible to design efficient, compact and low-cost front-end modules.
Claims23
A radio frequency transmission front-end module, comprising:
- a radio frequency integrated circuit comprising at least two electrical connection zones a first zone of which, intended to transmit a signal and a second zone intended to be connected to the ground,
- a disc with the basis of a self-biased magnetic material comprising a first main surface and a second main surface opposite to the first,
- wherein:
- a first dielectric material and a second dielectric material forming a respective side coating layer of the radio frequency integrated circuit and of the disc by maintaining them mechanically in position to each other, and
- a redistribution layer RDL of electrical connections placed above the coating layer, comprising said first dielectric material, the redistribution layer RDL comprising a metal track for electrical connection of the signal connecting the second main surface of the disc and said first electrical connection zone of the integrated circuit to enable the transmission of an electrical signal between the disc and the integrated circuit.
2 more elements
A method for manufacturing a radio frequency transmission front-end module, comprising:
- providing a radio frequency integrated circuit, a disc with the basis of a self-biased magnetic material, a first carrier substrate and a second carrier substrate, the radio frequency integrated circuit comprising several electrical connection zones, a first zone of which, intended to transmit an electrical signal and a second zone intended to be connected to the ground, and the disc comprising a first main surface and a second main surface opposite the first, then
- assembling the radio frequency integrated circuit and the disc by serving as the first carrier substrate as a support for first steps of manufacturing the front-end module, then as a transfer substrate on the second support substrate for second steps of manufacturing the front-end module;
- by using at least one from among a first dielectric material and a second dielectric material to form, by an FOWLP-type packaging method, a respective side coating layer of said radio frequency integrated circuit and of the disc and maintain them mechanically in position to each other;
- by forming a redistribution layer RDL of electrical connections placed above the coating layer, comprising said first dielectric material and comprising a metal track for electrical connection of the signal connecting the second main surface of the disc and said first electrical connection zone of the integrated circuit to enable the transmission of an electrical signal between the disc and the integrated circuit.
1 more element
Dependencies are inferred from the claim text.