High-frequency module and communication device
AssigneeMurata Manufacturing Co., Ltd.
InventorYukiya Yamaguchi
Life of this patent
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Abstract
A high-frequency module includes: a module substrate that has major surfaces that face each other; a plurality of post electrodes placed on the major surface; and a power amplification component placed on the major surface. The power amplification component includes: a base material that has major surfaces and that face each other, the major surface being located between the major surface and the major surface; an amplification transistor formed on a side of the major surface of the base material; and a metal electrode placed on the major surface and connected to the amplification transistor.
Claims20
A high-frequency module comprising:
- a module substrate having a first major surface and a second major surface, the first major surface and the second major surface facing each other;
- a plurality of external connection terminals placed on the second major surface;
- and
- a power amplification component placed on the second major surface, wherein
- the power amplification component includes
- a base material having a third major surface and a fourth major surface, the third major surface and the fourth major surface facing each other, the third major surface being located between the second major surface and the fourth major surface,
- an amplification transistor formed on a side of the fourth major surface of the base material, and
- a first metal electrode placed on the fourth major surface and connected to the amplification transistor.
Dependencies are inferred from the claim text.