Back to results
US 12,525,554 B2Granted
Semiconductor device with MMIC and pads reducing wire length
AssigneeMitsubishi Electric Corporation
InventorShin Chaki
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes: an MMIC having a DC pad; a bias substrate; a plurality of MIM capacitors mounted on the bias substrate; a plurality of pads provided on the bias substrate and respectively connected to overlying electrodes of the MIM capacitors; and a wire connecting the DC pad to any one of the plurality of pads, wherein the plurality of pads are arranged between the DC pad and the plurality of MIM capacitors in a planar view, and extend parallel to a row of the plurality of MIM capacitors laterally arranged side by side.
Claims20
A semiconductor device comprising:
- an MMIC having a DC pad;
- a bias substrate;
- a plurality of MIM capacitors mounted on the bias substrate;
- a plurality of pads provided on the bias substrate and respectively connected to overlying electrodes of the MIM capacitors;
- and
- a wire connecting the DC pad to any one of the plurality of pads,
- wherein the plurality of pads are arranged between the DC pad and the plurality of MIM capacitors in a planar view, and extend parallel to a row of the plurality of MIM capacitors laterally arranged side by side, each of the plurality of pads being entirely spaced from each other.
4 more elements
Dependencies are inferred from the claim text.