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US 12,525,254 B2Granted
Bonding module and cable design for magnetic tape heads
AssigneeInternational Business Machines Corporation
InventorsBrandon Purcell, Ho-Yiu Lam, Aren Yeghissian-Kanneian
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Abstract
Provided are devices and methods relating to a magnetic tape head module, including an apparatus comprising a magnetic tape head module including a module bonding pad region including a first row of module bonding pads and a second row of module bonding pads, the first row of module bonding pads and the second row of module bonding pads configured to accommodate wirebonds thereon.
Claims20
An apparatus comprising:
- a magnetic tape head module including a plurality of elements configured to perform at least one operation selected from the group consisting of reading data from a magnetic tape and writing data to a magnetic tape;
- the magnetic tape head module further including a module bonding pad region including a first row of module bonding pads and a second row of module bonding pads, the first row of module bonding pads and the second row of module bonding pads configured to accommodate wirebonds thereon;
- wherein the module bonding pad region includes a stepped structure configuration so that the first row of module bonding pads is positioned at a different height than the second row of module bonding pads.
An apparatus comprising:
- a magnetic tape head module including a plurality of elements configured to perform at least one operation selected from the group consisting of reading data from a magnetic tape and writing data to a magnetic tape, the magnetic tape head module further including a first row of module bonding pads and a second row of module bonding pads;
- a cable including a first row of cable bonding pads and a second row of cable bonding pads;
- the magnetic tape head module and the cable positioned so that the first row of module bonding pads and the first row of the cable bonding pads are positioned between the second row of module bonding pads and the second row of cable bonding pads;
- a first group of wirebonds electrically coupling the first row of module bonding pads and the first row of cable bonding pads;
- and
- a second group of wirebonds electrically coupling the second row of module bonding pads to the second row of cable bonding pads;
- wherein the second group of wirebonds is positioned to extend to a greater height than the first group of wirebonds.
4 more elements
A method for forming an apparatus comprising:
- providing a tape head module including a plurality of elements configured to perform at least one operation selected from the group consisting of reading data from a magnetic tape and writing data to a magnetic tape;
- providing the tape head module to include a module bonding pad region including a first row of module bonding pads and a second row of module bonding pads on the tape head module;
- providing a cable including a cable bonding pad region including a first row of cable bonding pads and a second row of cable bonding pads;
- positioning the first row of module bonding pads and the first row of the cable bonding pads between the second row of module bonding pads and the second row of cable bonding pads;
- providing at least one of the module bonding pad region and the cable bonding pad region with a stepped structure configuration so that the at least one of the module bonding pad region and the cable bonding pad region has the first row at a different height than the second row;
- providing a first group of wirebonds coupling a plurality of the bonding pads in the first row of module bonding pads to a plurality of the bonding pads in the first row of cable bonding pads;
- and
- providing a second group of wirebonds coupling a plurality of the bonding pads in the second row of module bonding pads to a plurality of the bonding pads in the second row of cable bonding pads.
5 more elements
Dependencies are inferred from the claim text.