Apparatus for treating substrate and method for treating a substrate
AssigneeSemes Co., Ltd.
InventorsJae Hong Kim, Hyeong Jun Cho, Sang Hyun Son, Sang Min Ha
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AssigneeSemes Co., Ltd.
InventorsJae Hong Kim, Hyeong Jun Cho, Sang Hyun Son, Sang Min Ha
Estimating the term…
The present invention provides a method for treating a substrate. The method for treating a substrate comprises: a monitoring step of calculating a flow rate of a liquid, comparing the calculated measurement flow rate of the liquid with a set flow rate of the liquid in a normal state, and determining whether an error occurs in the measurement flow rate; and when an error is determined to occur in the measurement flow rate in the monitoring step, a feedback step of performing feedback control of a discharge flow rate of the liquid discharged to the substrate, wherein the feedback step determines a type of the error, and differently performs the feedback control according to the determined type of the error.
A method for treating a substrate, comprising:
A method for controlling a flow rate, the method comprising:
An apparatus for treating a substrate, comprising:
Dependencies are inferred from the claim text.