Thermopile laser sensor with response time acceleration and methods of use and manufacture

A sensor apparatus, comprising:

• at least one sensor body having at least one first sensor body recess and at least one second sensor body recess formed therein, the at least one first sensor body recess having at least one first surface;
• at least one thermally conductive member positioned on the at least one first surface of the at least one first sensor body recess;
• at least one substrate positioned in the at least one first sensor body recess in thermal communication with the at least one sensor body via the at least one thermally conductive member, the at least one substrate including, including:
• at least one first substrate region having at least one first surface and at least one second surface;
• at least one second substrate region having at least one first surface and at least one second surface;
• at least one absorber formed on or attached to the at least one first surface of the at least one second substrate region, the at least one absorber configured to absorb at least a portion of a beam of laser energy;
• and
• at least one first thermal sensor formed on or attached to the at least one second surface of the at least one first substrate region, the at least one first thermal sensor having a plurality of first thermocouple junctions and a plurality of second thermocouple junctions in thermal communication with the at least one first substrate region, the at least one second substrate region, and the at least one sensor body;
• at least one second thermal sensor positioned in the at least one second sensor body recess, the at least one second thermal sensor in thermal communication with the at least one sensor body;
• and
• at least one thermal barrier positioned between the at least one substrate and the at least one second thermal sensor, the at least one thermal barrier configured to reduce the rate of transfer of thermal energy from the at least one first substrate region and the at least one second substrate region to the at least one second thermal sensor.