Surface-acoustic-wave temperature and pressure sensing device and manufacturing method thereof

A surface-acoustic-wave temperature and pressure sensing device, comprising:

• a first high-temperature-resistant substrate;
• and
• a second high-temperature-resistant substrate bonded to the first high-temperature-resistant substrate, wherein a recess is formed in the second high-temperature-resistant substrate to form a sealed cavity between the first high-temperature-resistant substrate and the second high-temperature-resistant substrate;
• first surface-acoustic-wave temperature sensors and surface-acoustic-wave pressure sensors are formed on a first surface of the first high-temperature-resistant substrate located in the cavity, and
• second surface-acoustic-wave temperature sensors are formed on a second surface of the first high-temperature-resistant substrate opposite the first surface;
• and
• wherein the first surface-acoustic-wave temperature sensors, the second surface-acoustic-wave temperature sensors, and the surface-acoustic-wave pressure sensors are electrically connected to one another;
• wherein the surface-acoustic-wave pressure sensors are located in a center of the first surface inside the cavity, and the first surface-acoustic-wave temperature sensors are located on an edge of the first surface inside the cavity;
• wherein the second surface-acoustic-wave temperature sensors are opposite to the first surface-acoustic-wave temperature sensors.