Polymer-based microfabricated thermal ground plane
AssigneeKelvin Thermal Technologies, Inc.
InventorsRyan John Lewis, Yung-Cheng Lee, Li-Anne Liew, Yunda Wang
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Abstract
Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.
Claims16
A thermal ground plane system comprising:
- a bottom layer;
- a top layer, wherein the top layer and the bottom layer are sealed together along at least one edge of the top layer and at least one edge of the bottom layer;
- a wicking layer comprising a plurality of microposts that are disposed on the bottom layer, and the plurality of the microposts comprises two different array geometries of microposts in two different regions, the two different array geometries comprise a difference in a cross-sectional area of the microposts along the bottom layer in the two different regions and a difference in a space between adjacent microposts in the two different regions;
- a vapor core comprising a plurality of pillars disposed on a top layer, wherein the plurality of pillars are separate and distinct from the plurality of microposts;
- and
- a printed circuit board coupled with the bottom layer of the thermal ground plane.
Dependencies are inferred from the claim text.