Back to results
US 12,522,702 B2Granted
Thin plate molding material and molded article
AssigneeJapan Composite Co., Ltd.
InventorsMasahiro Hakotani, Hirokuni Fujita, Takashi Tsukamoto
Life of this patent
Estimating the term…
Abstract
A thin plate molding material includes a resin composition containing a resin component and a filling material, and a reinforced fiber with a predetermined fiber length. The content ratio of the reinforced fiber is a predetermined ratio. The mixing ratio of the resin component is a predetermined ratio.
Claims3
A thin plate molding material for molding a molded article having a thickness of 1.5 mm or less, comprising:
- a resin composition containing a resin component and a filling material;
- and
- a reinforced fiber with a fiber length of 10 mm or more and 60 mm or less, wherein
- a content ratio of the reinforced fiber is 21 vol % or more and 28 vol % or less,
- a mixing ratio of the resin component is 49 vol % or more and 56 vol % or less,
- the filling material contains a filler having an average value of maximum particle lengths of 15 μm or more and 300 μm or less, or a filler having an average value of maximum particle lengths of less than 15 μm,
- the resin component contains a double bond-containing curable polymer,
- the double bond-containing curable polymer has a double bond equivalent of 200 g/eq. or more and 297 g/eq. or less,
- the first filler contains a hollow glass with an average value of maximum particle lengths of 15 μm or more and 50 μm or less, and milled carbon fibers with an average value of maximum lengths of 100 μm or more and 300 μm or less, and
- a mixing ratio of the hollow glass to 100 parts by mass of a total amount of the hollow glass and the milled carbon fibers is 60 parts by mass or more and 80 parts by mass or less.
7 more elements
Dependencies are inferred from the claim text.