Back to results
US 12,521,946 B2Granted
Bond assembly jig preparation methods using thermosetting bismaleimide resins
AssigneeThe Boeing Company
InventorsGeorge E. Bible, Peter M. Winzek
Life of this patent
Estimating the term…
Abstract
A method for preparing a bond assembly jig (BAJ) includes forming a cutter relief groove in the BAJ, filling the cutter relief groove of the BAJ with a material, and curing the material after said filling.
Claims20
A method for preparing a bond assembly jig (BAJ), comprising:
- forming a cutter relief groove in the BAJ;
- filling the cutter relief groove of the BAJ with a material;
- curing the material after said filling;
- and
- laying up a part on the BAJ after said curing.
2 more elements
A method for preparing a bond assembly jig (BAJ), comprising:
- forming a cutter relief groove in the BAJ, wherein the cutter relief groove extends from an exposed surface of the BAJ into a main body of the BAJ;
- cleaning the cutter relief groove with a solvent;
- after said cleaning, filling the cutter relief groove of the BAJ with a material, wherein the material comprises a bismaleimide (BMI) resin;
- covering an exposed surface of the material with a release film and a caul sheet;
- curing the material after said filling after said covering;
- and
- laying up a part on the BAJ after said curing.
4 more elements
A method for preparing a bond assembly jig (BAJ), comprising:
- forming a cutter relief groove in the BAJ, wherein the cutter relief groove extends from an exposed surface of the BAJ into a main body of the BAJ;
- cleaning the cutter relief groove with a solvent;
- after said cleaning, over-filling the cutter relief groove of the BAJ with a material, wherein the material comprises a plurality of overlaid strips formed of bismaleimide (BMI) resin;
- covering an exposed surface of the material with a release film and a caul sheet;
- sealing outer perimeter edges of the caul sheet with a tape;
- curing the material after said filling after said covering;
- laying up a part on the BAJ after said curing;
- forming a groove in the part and the material, wherein the portion of the groove formed in the material provides a sub-groove;
- removing the part from the BAJ after said forming the groove;
- and
- depositing preg material into the sub-groove after said removing.
8 more elements
A method for preparing a bond assembly jig (BAJ), comprising:
- forming a cutter relief groove in the BAJ;
- filling the cutter relief groove of the BAJ with a material;
- covering an exposed surface of the material with a release film and a caul sheet;
- and
- curing the material after said filling and said covering.
2 more elements
Dependencies are inferred from the claim text.