Molding method

A molding method of integrally molding thermoplastic resin and a flexible substrate mounted with a circuit and an electronic component on a flat plate having flexibility to form a three-dimensional shape, with the electronic component being mounted on the circuit, the molding method comprising the steps of:

• (a) preparing the flexible substrate, having the mounted circuit and electronic component, with an unfolded shape corresponding to the three-dimensional shape;
• (b) inserting the flexible substrate in the unfolded shape into an open mold and, while the mold is open, elastically deforming the flexible substrate from the unfolded shape into the three-dimensional shape and holding the flexible substrate in the three-dimensional shape along the mold;
• and
• (c) closing the mold and filling a resin filling space of the mold with thermoplastic resin such that the flexible substrate in the three-dimensional shape becomes non-releasably integrated with the molded thermoplastic resin,
• wherein the step (c) includes clamping the flexible substrate against a surface of a first part of the mold using clamping members that are protruded from a surface of a second part of the mold, the clamping members including a plurality of pins that are protruded into the resin filling space.