Sn solder paste comprising cu-co metal particles
AssigneeNihon Superior Co., Ltd.
InventorTetsuro Nishimura
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Abstract
By using a solder paste including powder of a lead-free solder alloy mainly composed of Sn and a metal particle with a melting point higher than a melting point of the lead-free solder alloy, in which the metal particle is formed of a Cu—Ni alloy having a Ni content of 0.1 to 90% by mass, or formed of a Cu—Co alloy having a Co content of 0.1 to 90% by mass, a solder bonded body that has heat resistance, thermal conductivity, and reliability higher than ever can be formed.
Claims7
A solder paste comprising powder of a lead-free solder alloy mainly comprising Sn and metal particles with a melting point higher than a melting point of the lead-free solder alloy, wherein the metal particles are an alloy consisting of Cu—Co having a Co content of 20 to 40% by mass.
Dependencies are inferred from the claim text.