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US 12,521,790 B2Granted
Thixomolding material
AssigneeSeiko Epson Corporation
InventorsShunsuke Uchizono, Setsuya Iwashita, Yasutoshi Hideshima, Fumiya Maeda, Koichi Ozaki, Tadao Fukuta
Life of this patent
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Abstract
A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
Claims2
A thixomolded article comprising:
- a surface;
- a matrix portion that contains Mg as a main component;
- and
- a particle portion that is dispersed in the matrix portion, wherein
- the particle portion contains SiC as a main component,
- a content of SiC is 2.0 mass % or more and 40.0 mass % or less,
- a tensile strength of the thixomolded article is 170 MPa or more and 350 MPa or less,
- a Young's modulus of the thixomolded article is 40 GPa or more and 80 GPa or less, and
- when a 500 μm square area starting from the surface is defined as A1, a 500 μm square area centered at a point 1 mm deep from the surface is defined as A2, an area fraction of the particle portion in the area A1 is defined as As [%], and an area fraction of the particle portion in the area A2 is defined as Ac [%]. |As−Ac|/Ac is 30.0% or less.
6 more elements
Dependencies are inferred from the claim text.