In situ inductor structure in buildup power planes

A package substrate comprising a plurality of buildup layers, each of the buildup layers including a dielectric material, a power plane, and electrically conductive vias;

• and an inductor structure in one of the buildup layers, the inductor structure including:
• an electrically conductive body;
• a magnetic structure including a non-electrically-conductive magnetic material, wherein:
• one of the magnetic structure or the electrically conductive body wraps around another one of the magnetic structure or the electrically conductive body to form the inductor structure therewith;
• and
• at least one of the electrically conductive body or the magnetic structure has a granular microstructure including randomly distributed particles presenting substantially non-linear particle-to-particle boundaries with one another;
• and
• a buffer layer adjacent to the magnetic structure, wherein an interface between the buffer layer and the magnetic structure has a non-flat configuration as compared with an interface between buildup layers of the substrate, wherein some particles of the magnetic structure are at least in part embedded within indentations of the buffer layer.

An integrated circuit device including:

• an integrated circuit component including one or more dies;
• and
• a package substrate including a plurality of buildup layers, the integrated circuit component electrically and mechanically coupled to the package substrate, each of the buildup layers including a dielectric material, a power plane, and electrically conductive vias;
• and an inductor structure in one of the buildup layers, the inductor structure including:
• an electrically conductive body;
• a magnetic structure including a non-electrically-conductive magnetic material, wherein:
• one of the magnetic structure or the electrically conductive body wraps around another one of the magnetic structure or the electrically conductive body to form the inductor structure therewith;
• and
• at least one of the electrically conductive body or the magnetic structure has a granular microstructure including randomly distributed particles presenting substantially non-linear particle-to-particle boundaries with one another;
• and
• a buffer layer adjacent to the magnetic structure, wherein an interface between the buffer layer and the magnetic structure has a non-flat configuration as compared with an interface between buildup layers of the substrate, wherein some particles of the magnetic structure are at least in part embedded within indentations of the buffer layer.

An integrated circuit device assembly including:

• one or more processing units;
• a memory coupled to the one or more processing units;
• and
• an integrated circuit device coupled to the memory and to the one or more processing units, the integrated circuit device including:
• an integrated circuit component including one or more dies;
• and
• a package substrate including a plurality of buildup layers, the integrated circuit component electrically and mechanically coupled to the package substrate, each of the buildup layers including a dielectric material, a power plane, and electrically conductive vias;
• and an inductor structure in one of the buildup layers, the inductor structure including:
• an electrically conductive body;
• a magnetic structure including a non-electrically-conductive magnetic material, wherein:
• one of the magnetic structure or the electrically conductive body wraps around another one of the magnetic structure or the electrically conductive body to form the inductor structure therewith;
• and
• at least one of the electrically conductive body or the magnetic structure has a granular microstructure including randomly distributed particles presenting substantially non-linear particle-to-particle boundaries with one another;
• and
• a buffer layer adjacent to the magnetic structure, wherein an interface between the buffer layer and the magnetic structure has a non-flat configuration as compared with an interface between buildup layers of the substrate, wherein some particles of the magnetic structure are at least in part embedded within indentations of the buffer layer.