Semiconductor device
AssigneeSamsung Electronics Co., Ltd.
InventorsSungki Lee, Jiyong Kim, Insub Kwak, Suin Kim, Chunghyun Ryu
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Abstract
A semiconductor device includes a first case, a second case coupled to the first case to form an inner space, a memory module disposed within the inner space, and including a module substrate and a plurality of electronic components mounted on the module substrate, and a heat dissipation chamber assembly provided in at least a portion of the first case, and including a heat diffusion chamber in thermal contact with at least one of the electronic components and a sidewall structure extending vertically toward the module substrate to surround the electronic component in thermal contact with the heat diffusion chamber.
Claims20
A semiconductor device, comprising:
- a first case and a second case, the first case and second case defining an inner space;
- a substrate in the inner space;
- at least one electronic component on the substrate;
- and
- a heat dissipation chamber assembly attached to the first case such that the heat dissipation chamber assembly is between the substrate and at least a portion of the first case, the heat dissipation chamber assembly including
- a heat diffusion chamber in thermal contact with the at least one electronic component, and
- a sidewall structure extending vertically towards the substrate, the sidewall structure including at least a first sidewall and a second sidewall extending in a horizontal direction such that the first sidewall and the second sidewall define at least one receiving groove surrounding the at least one electronic component and such that a horizontal extension length of at least one of the first sidewall or the second sidewall is greater than a horizontal length of a corresponding sidewall of the at least one electronic component.
A semiconductor device, comprising:
- a first case including a base plate and a heat dissipation chamber assembly attached to the first case, the heat dissipation chamber assembly including a heat diffusion chamber;
- a second case defining an inner space with the first case;
- a substrate in the inner space between the first case and the second case;
- and
- at least one electronic component on the substrate,
- wherein the heat diffusion chamber overlaps and thermally contacts the at least one electronic component, and
- wherein the heat dissipation chamber assembly includes at least a first sidewall and a second sidewall extending in a horizontal direction such that the first sidewall and the second sidewall define at least one receiving groove surrounding the at least one electronic component and such that a horizontal extension length of at least one of the first sidewall or the second sidewall is greater than a horizontal length of a corresponding sidewall of the at least one electronic component.
Dependencies are inferred from the claim text.