Package structure with a plurality of corner openings comprising different shapes and method of fabricating the same

A package structure, comprising:

• a circuit substrate;
• an interposer structure disposed on and electrically connected to the circuit substrate;
• a first semiconductor die and a plurality of second semiconductor dies disposed on a backside surface of the interposer structure and electrically connected to the interposer structure;
• an insulating encapsulant disposed on the backside surface of the interposer structure and surrounding the first semiconductor die and the plurality of second semiconductor dies;
• a first stiffener ring and a second stiffener ring attached to the circuit substrate, wherein the first stiffener ring is located in between the circuit substrate and the second stiffener ring, the second stiffener ring is stacked on top of the first stiffener ring along a first direction and physically separated from the circuit substrate by the first stiffener ring, and
• the interposer structure, the first semiconductor die and the plurality of second semiconductor dies are encircled by the first stiffener ring and the second stiffener ring, and
• wherein the first stiffener ring comprises a frame portion and a plurality of protruding parts extending out from inner surfaces of the frame portion towards the interposer structure, and each of the plurality of protruding parts are separated from one another, and
• wherein the second stiffener ring consists of a second frame portion, wherein the frame portion and the plurality of protruding parts of the first stiffener ring are overlapped with the second frame portion along the first direction, outer sidewalls of the second stiffener ring are aligned with outer sidewalls of the first stiffener ring, and a portion of inner sidewalls of the second stiffener ring is aligned with inner sidewalls of the plurality of protruding parts of the first stiffener ring, while another portion of the inner sidewalls of the second stiffener ring is misaligned with the inner sidewalls of the plurality of protruding parts of the first stiffener ring, and
• wherein from a top view of the package structure, a total opening area of the first stiffener ring is greater than a total opening area of the second stiffener ring.

A package structure, comprising:

• a semiconductor package disposed on a substrate;
• and
• a continuous ring structure disposed on the substrate and surrounding the semiconductor package, wherein when a minimum distance of a first sidewall of the semiconductor package to an inner sidewall of the continuous ring structure is d3, a minimum distance of a second sidewall of the semiconductor package to an inner sidewall of the continuous ring structure is d4, then a maximum distance d5 from a corner of the semiconductor package to an inner corner of the continuous ring structure satisfy the following relationship:
• d5√{square root over ( )}((d3)2+(d4)2), and
• the first sidewall is perpendicular to the second sidewall,
• and wherein air spaces exist in between the inner sidewall of the continuous ring structure and the first sidewall of the semiconductor package, and between the inner sidewall of the continuous ring structure and the second sidewall of the semiconductor package, and
• a second ring structure disposed on top of the continuous ring structure and surrounding the semiconductor package, and physically separated from the substrate, wherein the second ring structure comprises a second frame portion with an overlapping part and non-overlapping parts, the overlapping part of the second frame portion is overlapped with the frame portion and the plurality of protruding parts of the continuous ring structure, and the non-overlapping parts of the second frame portion are located at four inner corners of the second ring structure, and the non-overlapping parts of the second frame portion are overhanging the continuous ring structure and exposed to the air spaces.