Method for manufacturing wafer having functional film

A method for manufacturing a wafer having a functional film, with an outer peripheral part of a top face of the wafer annularly exposed, the method comprising:

• spin-coating a high-viscosity coating material that contains a functional film constituent that can cure when heated over the top face of the wafer to form a coating film;
• subsequent to the formation of the coating film, supplying a first cleaning liquid to the outer peripheral part of the top face of the wafer having the coating film formed thereon and kept rotated, to remove the coating film on the outer peripheral part of the top face of the wafer;
• subsequent to the supplying of the first cleaning liquid to remove the coating film on the outer peripheral part of the top face of the wafer, heating the coating film on the wafer at a temperature lower than the temperature required for hardening the functional film constituent components, to form a fluidity suppressed film in which the fluidity of the coating film has been suppressed;
• subsequent to the formation of the fluidity suppressed film, supplying a second cleaning liquid to the outer peripheral part of the top face of the wafer having the fluidity suppressed film formed thereon and kept rotated, to remove the fluidity suppressed film on the top face of the wafer;
• and
• subsequent to the removing of the fluidity suppressed film on the top face of the wafer, heating the fluidity suppressed film on the wafer at a temperature equal to or higher than that required for hardening the functional film constituent components, to demonstrate a function of the functional film constituent by curing, to be served as the functional film.