Substrate treating composition and method for fabricating a semiconductor device using the same
AssigneesSamsung Electronics Co., Ltd., Nissan Chemical Corporation
InventorsJu-Young Kim, Hyunwoo Kim, Makoto Nakajima, Satoshi Takeda, Shuhei Shigaki, Wataru Shibayama
Life of this patent
Estimating the term…
Abstract
Provided is a substrate treating composition. The substrate treating composition includes a first monomer, a second monomer and an acid. The first monomer is represented by Formula 1 and the second monomer is represented by Formula 7. The molecular weight of the solid content of the substrate treating composition including the first monomer, the second monomer and the acid is from about 1,000 g/mol to about 50,000 g/mol. X—Si(R1)2(R2) [Formula 1] Y—Si(R3)3 [Formula 7]
Claims8
A substrate treating composition, consisting essentially of a solid content and a solvent, the solid content consisting a first monomer, a second monomer, a dehydration-condensation product of the first monomer and the second monomer, and an acid, wherein
- the first monomer is represented by Formula 1:
- X—Si(R1)2(R2) [Formula 1]
- wherein each of R1 and R2 is an alkyl group of 1 to 20 carbon atoms or an alkoxy group of 1 to 20 carbon atoms, and X is represented by Formula 2 or Formula 4:
- the second monomer is represented by Formula 7:
- Y—Si(R3)3 [Formula 7]
- wherein R3 is an alkoxy group of 1 to 20 carbon atoms, and Y is represented by Formula 8, Formula 9, Formula 10, Formula 11, Formula 12:
- in which Ts is a p-toluenesulfonyl group,
- in which Ms is a methanesulfonyl group,
- in which Ms is a methanesulfonyl group,
- wherein a molecular weight of the dehydration-condensation product of the first monomer and the second monomer is from 1,000 g/mol to 100,000 g/mol.
Dependencies are inferred from the claim text.