High bandwidth optical interconnection architectures

An optical system, comprising:

• a board;
• a package substrate coupled to the board, the package substrate having an uppermost surface;
• a compute die coupled to the package substrate;
• a first photonics die and a second photonics die coupled to the package substrate, the compute die laterally between the first photonics die and the second photonics die, wherein the first photonics die is coupled to the compute die by a first bridge in the package substrate, and the second photonics die is coupled to the compute die by a second bridge in the package substrate, wherein each of the first bridge and the second bridge is a discrete component set in a cavity in the package substrate, and wherein each of the first bridge and the second bridge has an uppermost surface below the uppermost surface of the package substrate;
• and
• a first optical waveguide and a second optical waveguide embedded in the package substrate, wherein a first end of the first optical waveguide is below the first photonics die and wherein a first end of the second optical waveguide is below the second photonics die, wherein a second end of the first optical waveguide is substantially coplanar with a first edge of the package substrate and a second end of the second optical waveguide is substantially coplanar with a second edge of the package substrate, and wherein the first optical waveguide is laterally spaced apart from the first bridge, and the second optical waveguide is laterally spaced apart from the second bridge.