Smart building sensing device with field replaceable sensors

A method for replacing sensors in the field, comprising:

• decoupling a first sensor assembly of a sensing device from an enclosure, the enclosure comprising an opening at a front end of the enclosure, the first sensor assembly comprising a first plurality of sensors, the sensor assembly comprising a front side and a back side opposite the front side, the front side of the sensor assembly residing proximate to the opening at the front end of the enclosure, the first sensor assembly coupled to a first end of a flexible jumper, wherein a second end of the flexible jumper is coupled to a printed circuit board (PCB) assembly residing within the enclosure, the PCB assembly residing proximate to the back side of the sensor assembly and distal to the front side of the sensor assembly, the flexible jumper configured to exert pressure to the back side of the sensor assembly toward the front side of the sensor assembly, wherein the pressure exerted by the flexible jumper pushes the sensor assembly away from the enclosure and through the opening;
• pulling the first sensor assembly away from the enclosure;
• detaching the first end of the flexible jumper from the first sensor assembly without detaching the second end of the flexibly jumper from the PCB assembly and without removing the PCB assembly from the enclosure;
• attaching a second sensor assembly to the first end of the flexible jumper, the second sensor assembly comprising a second plurality of sensors;
• and
• coupling the second sensor assembly to the enclosure.