High-frequency dielectric heating adhesive sheet

A high-frequency dielectric heating adhesive sheet comprising an adhesive layer that at least comprises a thermoplastic resin (A) and a dielectric material that generates heat upon application of a high-frequency electric field, wherein

• the thermoplastic resin (A) includes silane-modified polyolefin,
• the adhesive layer contains no conductive substance,
• a melt flow rate (MFR) at 190 degrees C. of the thermoplastic resin (A) is in a range from 2 g/10 min to 50 g/10 min,
• the silane-modified polyolefin is at least one selected from the group consisting of a copolymer of a silyl group-containing compound and olefin, and silane-modified polyolefin in which a silyl group-containing compound is graft-polymerized onto polyolefin,
• the olefin is at least one selected from the group consisting of ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-heptene, 4-methyl-1-pentene, 4-methyl-1-hexene, and 4,4-dimethyl-1-pentene, and
• the polyolefin onto which the silyl group-containing compound is graft-polymerized is a homopolymer of propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-heptene, 4-methyl-1-pentene, 4-methyl-1-hexene, or 4,4-dimethyl-1-pentene, or a copolymer of two or more thereof.