Glass or glass ceramic articles with copper-metallized through holes and processes for making the same
AssigneeCorning Incorporated
InventorChukwudi Azubuike Okoro
Life of this patent
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AssigneeCorning Incorporated
InventorChukwudi Azubuike Okoro
Estimating the term…
A process for heating a glass or glass ceramic article with copper-metallized through holes includes heating the article from a first temperature to a second temperature. The first temperature is greater than or equal to 200° C. and less than or equal to 300° C., and the second temperature is greater than or equal to 350° C. and less than or equal to 450° C. An average heating rate during the heating of the article from the first temperature to the second temperature is greater than 0.0° C./min and less than 8.7° C./min. An article includes a glass or glass ceramic substrate having at least one through hole penetrating the substrate in a thickness direction; and copper present in the at least one through hole. The article does not comprise radial cracks.
A glass or glass ceramic article comprising:
Dependencies are inferred from the claim text.