Sealant, bag for transporting and packaging of silicon material
AssigneeDai Nippon Printing Co., Ltd.
InventorsHiroyoshi Nakajima, Katsuyuki Motai, Yuka Tachikawa, Makoto Mizoshiri, Kazushi Sato
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AssigneeDai Nippon Printing Co., Ltd.
InventorsHiroyoshi Nakajima, Katsuyuki Motai, Yuka Tachikawa, Makoto Mizoshiri, Kazushi Sato
Estimating the term…
A packaging material used for a bag for transporting of a silicon material is a laminate in which a first resin base, barrier, second resin base, resin, and sealant layers are laminated in that order. A resin layer indentation elastic modulus is smaller than an indentation elastic modulus of each of the first and second resin base layers by one or more orders of magnitude, a sealant layer indentation elastic modulus is smaller than a first resin base layer indentation elastic modulus of and a second resin base layer indentation elastic modulus by one or more orders of magnitude, and a difference between the first resin base layer indentation elastic modulus and the second resin base layer indentation elastic modulus is smaller than a difference between the second resin base layer indentation elastic modulus and the indentation elastic modulus of the resin layer.
A package of a silicon material, comprising:
Dependencies are inferred from the claim text.