Techniques and apparatuses for bonding laminate structures

Abstract

Methods, apparatuses, devices, and substrates are described. Multiple layers of a substrate may be bonded using a laser beam that is rotating about an axis and while the substrate is laterally translated with respect to the laser beam. Further, a direction of the laser beam may be modified such that the laser beam is incident on a surface of a layer of the substrate at an acute angle with respect to the surface. In such cases, the respective layers of the substrate may be bonded by irradiating the surface with the rotating laser beam, thereby resulting in spiral-shaped bonding lines between the layers. The layers may be bonded when one of the layers is coupled with an element (e.g., a blocking element), and the acute angle of the laser beam may enable irradiation an area that is below the element while leaving the element unaffected by the laser beam.

Dependencies are inferred from the claim text.