Power module
AssigneeSemiconductor Components Industries, LLC
InventorsYushuang Yao, Chee Hiong Chew, Vemmond Jeng Hung Ng, Chuncao Niu, Sravan Vanaparthy
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Abstract
A method includes attaching a power electronic substrate to a bottom of a frame. The frame has a box-like rectangular shape with an open top and an open bottom. The method further includes disposing an external conductive terminal on the frame. The external conductive terminal has at least one terminal stub that extends on to the front surface of the power electronic substrate. The method further includes welding the at least one terminal stub to at least one circuit trace disposed on the front surface of the power electronic substrate.
Claims24
A power module, comprising:
- a frame having a base and at least one sidewall extending from the base of the frame and defining a cavity;
- a power electronic substrate attached to the base of the frame, a circuit trace and a die disposed on a front surface of the power electronic substrate within the cavity of the frame, the die including a device junction, a bottom surface of the power electronic substrate being exposed through an opening in the base of the frame;
- at least one signal pin directly attached to a connection point on the front surface of the power electronic substrate;
- an external conductive terminal disposed on a top surface of a sidewall of the frame;
- and
- a conductive base plate thermally coupled to the bottom surface of the power electronic substrate exposed through the opening in the base of the frame, the conductive base plate absorbing at least some of a thermal load at the connection point and reducing a device junction-to-connection point thermal resistance of the power module.
A power module, comprising:
- a frame having a box-like rectangular shape made of a base and a sidewall extending from the base and defining a cavity;
- and
- a power electronic substrate directly attached to the base of the frame with a front surface of the power electronic substrate being exposed to the cavity and at least one circuit trace disposed on the front surface of the power electronic substrate, the power electronic substrate including a device junction, wherein a bottom surface of the power electronic substrate is exposed through an opening in the base of the frame.
A power module, comprising:
- a frame having a base and four sidewalls extending from the base and defining a cavity;
- a power electronic substrate attached to the base of the frame, the power electronic substrate having a front surface exposed within the cavity with at least one circuit trace disposed on the front surface of the power electronic substrate, junction wherein a bottom surface of the power electronic substrate is exposed through an opening in the base of the frame;
- an external conductive terminal having a horizontal orientation disposed on a top surface of a sidewall of the frame;
- and
- at least one signal pin that is at least partially embedded in one of the four sidewalls of the frame and wire bonded to a trace or device disposed on the front surface of the power electronic substrate.
A method, comprising:
- attaching a power electronic substrate to a base of a frame in a power module, the frame having at least one sidewall extending from the base of the frame, at least one circuit trace disposed on a front surface of the power electronic substrate, the power electronic substrate including a device junction, wherein a bottom surface of the power electronic substrate is exposed through an opening in the base of the frame;
- disposing an external conductive terminal disposed on a top of the at least one sidewall the frame, the external conductive terminal connected to at least one terminal stub that extends on to the front surface of the power electronic substrate;
- and
- connecting the at least one terminal stub directly on to the at least one circuit trace disposed on the front surface of the power electronic substrate.
Dependencies are inferred from the claim text.