Electrical lead-out structure and preparation method thereof, hermetic apparatus, and optical communication device

An electrical lead-out structure, used for hermetic package, wherein the electrical lead-out structure comprises:

• a flexible circuit board, and
• a packaging layer configured to be soldered to a hermetic housing to create a hermetic connection between the electrical lead-out structure and the hermetic housing,
• the flexible circuit board comprising a stacked electrical signal layer and a reinforcing layer,
• the reinforcing layer is provided with a window that passes through the reinforcing layer, the electrical signal layer is adjacent to the window, the packaging layer fills the window, and a side that is of the packaging layer and that faces the electrical signal layer is provided insulatingly adjacent to the electrical signal layer,
• wherein the packaging layer comprises a glass substrate layer and a metal layer that are stacked, the glass substrate layer fills the window in the reinforcing layer, and the metal layer is disposed on an area of the glass substrate layer away from the electrical signal layer.