Light-emitting module, method of manufacturing wiring substrate, and method of manufacturing light-emitting module

A light-emitting module comprising:

• one or more light-emitting devices each including
• a plurality of light-emitting elements, and
• a package including an upper surface provided with the plurality of light-emitting elements and a lower surface having a wiring region;
• and
• a wiring substrate including a metal portion, an electrode portion, and an insulating portion insulating the metal portion from the electrode portion, the wiring substrate defining one or more first through holes and including a mounting surface on which the one or more light-emitting devices are mounted, wherein
• the mounting surface of the wiring substrate includes a first region where the metal portion defines an uppermost surface, a second region where the electrode portion defines an uppermost surface, and a third region where the insulating portion defines an uppermost surface,
• the first region and the second region are separated from each other by the third region on the mounting surface,
• a boundary of each of the one or more first through holes is defined in the first region on the mounting surface,
• the wiring region of each of the one or more light-emitting devices is bonded to the electrode portion of the wiring substrate, and
• each of the one or more first through holes is configured to receive a fixing member to fix the wiring substrate to an additional member.