Radio frequency amplifier

A radio frequency amplifier comprising:

• a semiconductor package including an output lead, a first input lead, a second input lead that is electrically isolated from the first input lead, the semiconductor package encasing:
• a first amplifier comprising a first transistor, wherein the first transistor includes a first transistor input coupled to the first input lead, and a first transistor output;
• a second amplifier comprising a second transistor, wherein the second transistor includes a second transistor input coupled to the second input lead, and a second transistor output coupled to the output lead, wherein the second transistor input is electrically isolated from the first transistor input;
• and
• a first inductive element and a second inductive element, wherein the first inductive element is coupled between the first transistor output and a first terminal of a capacitor, and the second inductive element is coupled between the second transistor output and the first terminal of the capacitor, wherein a second terminal of the capacitor is coupled to ground.

A radio frequency amplifier comprising:

• a semiconductor package including an output lead, a first input lead, a second input lead, the semiconductor package encasing:
• a first amplifier comprising a first transistor, wherein the first transistor includes a first transistor input coupled to the first input lead, and a first transistor output;
• a second amplifier comprising a second transistor, wherein the first transistor includes a second transistor input coupled to the second input lead, and a second transistor output coupled to the output lead;
• a first inductive element and a second inductive element, wherein the first inductive element is coupled between the first transistor output and a first terminal of a capacitor, and the second inductive element is coupled between the second transistor output and the first terminal of the capacitor, wherein a second terminal of the capacitor is coupled to ground;
• and
• a first microstrip line outside of the semiconductor package and coupled between the first inductive element and the second inductive element, wherein the first microstrip line is coupled to the capacitor, and wherein the capacitor is a surface mount capacitor outside of the semiconductor package.

A packaged amplifier device comprising:

• a first input lead and a second input lead that is electrically isolated from the first input lead coupled to a package;
• an output lead coupled to the package;
• a first amplifier with a first transistor, wherein the first transistor includes a first transistor input coupled to the first input lead, and a first transistor output;
• a second amplifier with a second transistor, wherein the second transistor includes a second transistor input coupled to the second input lead, and a second transistor output coupled to the output lead, wherein the second transistor input is electrically isolated from the first transistor input;
• and
• a first inductive element and a second inductive element, wherein the first inductive element is coupled between the first transistor output and a first terminal of a capacitor, the second inductive element is coupled between the second transistor output and the first terminal of the capacitor, and a second terminal of the capacitor is coupled to ground.