Semiconductor package mounting platform with integrally formed heat sink

A semiconductor package, comprising:

• a mounting platform comprising an electrically insulating substrate and one or more structured metallization layers;
• a semiconductor die mounted on an upper surface of the mounting platform, the semiconductor die comprising a first terminal and a second terminal, the first terminal disposed on a rear surface of the semiconductor die that faces the upper surface of the mounting platform, the second terminal disposed on a first surface of the semiconductor die that faces away from the upper surface of the mounting platform;
• and
• a heat sink integrally formed in the mounting platform,
• wherein the heat sink is disposed directly underneath the semiconductor die and is thermally coupled to the semiconductor die,
• wherein the heat sink extends from the upper surface of the mounting platform to a lower surface of the mounting platform that is opposite the upper surface of the mounting platform,
• wherein the heat sink comprises one or more discrete metal blocks disposed within an opening formed in the electrically insulating substrate,
• wherein the mounting platform comprises one or more vertical connectors extending from the upper surface of the mounting platform to the lower surface of the mounting platform,
• wherein the one or more vertical connectors are electrically connected with the semiconductor die, and
• wherein the heat sink and each of the one or more vertical connectors are elongated structures along a first direction that is parallel to the upper surface of the mounting platform, and wherein the heat sink is longer and/or wider than the each of the one or more vertical connectors, the length of the heat sink being measured in the first direction, the width of the heat sink being measured in a second direction that is parallel to the upper surface of the mounting platform and perpendicular to the first direction.