Surface-mount capacitor
AssigneeElna Company Ltd.
InventorsTadahiro Nakamura, Kaori Matsumura, Naozumi Kimura
Life of this patent
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Abstract
In a chip type capacitor formed by attaching a seat plate to a capacitor, generation of voids or cracks due to flux gas generated at the time of soldering is suppressed. When providing auxiliary terminals for increasing the soldering strength on a seat plate for chipping, which enables a lead same direction type capacitor to be surface mounted, a gas release groove, preferably formed as a slit to release flux gas generated at the time of soldering, is formed on each of the auxiliary terminals.
Claims5
A surface-mount capacitor comprising a capacitor main body from which a pair of lead terminals are led out in a same direction from a sealing part of a bottomed cylindrical outer case with a capacitor element built therein, and a synthetic resin seat plate mounted on a sealing part side of the outer case, wherein
- the seat plate has a pair of lead terminal insertion holes through each of which one of the lead terminals is inserted, lead terminal housing grooves extending from each of the lead terminal insertion holes to opposite side edges of the seat plate in opposite directions away from each other are formed on a bottom surface of the seat plate, and auxiliary terminals that are integrated with the lead terminals at the time of soldering are embedded along each of the lead terminal housing grooves,
- each of the lead terminals is inserted into one of the lead terminal insertion holes, a distal portion of each of the lead terminals is housed within one of the lead terminal housing grooves by being bent, and is soldered at a prescribed position of a circuit board together with one of the auxiliary terminals, and
- a gas release groove for releasing flux gas generated at the time of the soldering is formed on each of the auxiliary terminals.
Dependencies are inferred from the claim text.