Template-based image processing for target segmentation and metrology
AssigneeApplied Materials, Inc.
InventorsXinhuo Xiao, Stephanie W. Chen, Waheb Bishara, Bin Lin
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Abstract
One or more images of a portion of a wafer with fabricated devices are acquired using an imaging tool. A pattern of repeating features in an input image of a wafer is identified using various methods, such as correlation and clustering of neighboring vectors. A template is generated based on the found pattern of repeating features. The template is aligned with the acquired image to identify target locations. The target locations are then isolated from the original image for performing detailed metrology.
Claims16
A method for performing metrology on a wafer, the method comprising:
- acquiring, using an imaging tool, one or more original images of an area of the wafer, wherein the wafer has a plurality of device features fabricated on it;
- creating, from the one or more original images or from a user input of a design pattern, an image template having an array of elements with a periodicity that mimics an identified pattern of repetition of the device features on the wafer, wherein creating the image template further comprises:
- creating, from the one or more original images, a binary image containing a plurality of blobs representing the device features;
- determining neighboring vectors between adjacent blobs of the plurality of blobs;
- and
- classifying the neighboring vectors into a plurality of groups to identify the pattern of repetition of the device features on the wafer;
- anchoring the image template on to an original image;
- dividing the original image into a plurality of segments;
- selecting one or more segments from the plurality of segments as target areas to perform metrology;
- performing metrology in the selected target areas to produce metrology data that is free of noise and image artifacts;
- and
- tuning process parameters using the metrology data to improve manufacturing yield and uniformity of the wafer.
A non-transitory machine-readable storage medium storing instructions which, when executed, cause a processing device to perform operations for performing metrology on a wafer, the operations comprising:
- acquiring, using an imaging tool, one or more original images of an area of the wafer, wherein the wafer has a plurality of device features fabricated on it;
- creating, from the one or more original images or from a user input of a design pattern, an image template having an array of elements with a periodicity that mimics an identified pattern of repetition of the device features on the wafer, wherein creating the image template further comprises:
- creating, from the one or more original images, a binary image containing a plurality of blobs representing the device features;
- determining neighboring vectors between adjacent blobs of the plurality of blobs;
- and
- classifying the neighboring vectors into a plurality of groups to identify the pattern of repetition of the device features on the wafer;
- anchoring the image template on to an original image;
- dividing the original image into a plurality of segments;
- selecting one or more segments from the plurality of segments as target areas to perform metrology;
- performing metrology in the selected target areas to produce metrology data that is free of noise and image artifacts;
- and
- tuning process parameters using the metrology data to improve manufacturing yield and uniformity of the wafer.
Dependencies are inferred from the claim text.