Current sensor for printed circuit board
AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsYongshun Sun, Eng Huat Toh
Life of this patent
Estimating the term…
Abstract
A contactless current sensing circuit for sensing current in a conductive wire on a dielectric substrate of a printed circuit board (PCB) includes a plurality of magnetic tunneling junction (MTJ) structures including first and second MTJ structures on a first side of the conductive wire, and third and fourth MTJ structures on a second side of the conductive wire opposite to the first side. The MTJ structures are located within the H-field induced by a current flowing through the conductive wire.
Claims7
A circuit comprising:
- a conductive wire on a dielectric substrate of a printed circuit board (PCB);
- a plurality of magnetic tunneling junction (MTJ) structures including first and second MTJ structures on a first side of the conductive wire;
- and
- third and fourth MTJ structures on a second side of the conductive wire opposite to the first side,
- wherein the first and second MTJ structures are packaged in a first chip, and the third and fourth MTJ structures are packaged in a second chip, the first chip located on the first side of the conductive wire and the second chip located on the second side of the conductive wire, and
- wherein the first, second, third and fourth MTJ structures are resistors in a Wheatstone bridge circuit.
An apparatus comprising:
- a printed circuit board (PCB) including a dielectric substrate;
- a conductive wire on the dielectric substrate;
- a plurality of magnetic tunneling junction (MTJ) structures including first and second MTJ structures on a first side of the conductive wire;
- and
- third and fourth MTJ structures on a second side of the conductive wire opposite to the first side,
- wherein the first and second MTJ structures are packaged in a first chip, and the third and fourth MTJ structures are packaged in a second chip, the first chip located on the first side of the conductive wire and the second chip located on the second side of the conductive wire, and
- wherein the first, second, third and fourth MTJ structures are resistors in a Wheatstone bridge circuit.
A method for forming a current sensing circuit, the method comprising:
- placing, on a printed circuit board (PCB) with a conductive wire, a plurality of magnetic tunneling junction (MTJ) structures including a first chip comprising first and second MTJ structures on a first side of the conductive wire, and a second chip comprising third and fourth MTJ structures on a second side of the conductive wire opposite to the first side,
- wherein the first and second MTJ structures are packaged in the first chip, and the third and fourth MTJ structures are packaged in the second chip, and
- wherein the first, second, third and fourth MTJ structures are resistors in a Wheatstone bridge circuit.
Dependencies are inferred from the claim text.