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US 12,510,428 B2Granted
Media-resistant pressure sensor for large pressure ranges
AssigneeInfineon Technologies AG
InventorsRainer Markus Schaller, Thomas Mueller, Bernhard Winkler
Life of this patent
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Abstract
In some embodiments, a pressure sensor may comprise a housing, a flexible membrane which, together with the housing, forms a hermetically closed cavity, a sensor element arranged in the hermetically closed cavity, and a gaseous medium in the hermetically closed cavity. The sensor may detect a change in a physical property, of the flexible membrane, associated with an external pressure pressing inward into the flexible membrane of the hermetically closed cavity.
Claims20
A pressure sensor, comprising:
- a housing;
- a flexible membrane which, together with the housing, forms a hermetically closed cavity;
- a printed circuit board (PCB) that is in the hermetically closed cavity;
- a sensor element, in the hermetically closed cavity and on a top surface of the PCB, configured to detect a change in a physical property, of the flexible membrane, associated with an external pressure pressing inward into the flexible membrane of the hermetically closed cavity;
- an application-specific integrated circuit (ASIC) semiconductor die, in the hermetically closed cavity and on the top surface of the PCB, electrically connected to the sensor element;
- a gaseous medium in the hermetically closed cavity;
- and
- a first pin, electrically connected to one of the sensor element or the ASIC semiconductor die, extending beyond a bottom surface of the PCB and through a lower surface of either the housing or a stopper within the housing.
5 more elements
A method, comprising:
- utilizing a pressure sensor in a pressure-carrying device to monitor a pressure of the pressure-carrying device based on a sensor element, of the pressure sensor, detecting a change in a physical property, of a flexible membrane of the pressure sensor, associated with an external pressure pressing inward into the flexible membrane of a hermetically closed cavity, of the pressure sensor and formed by a housing of the pressure sensor and the flexible membrane, holding the sensor element and a gaseous medium,
- wherein the pressure sensor is within the hermetically closed cavity, and comprises
- an application-specific integrated circuit (ASIC) semiconductor die, in the hermetically closed cavity and on a top surface of a printed circuit board (PCB), electrically connected to the sensor element, and
- a pin electrically connected to one of the sensor element or the ASIC semiconductor die, extending beyond a bottom surface of the PCB and through a lower surface of either the housing or a stopper within the housing.
1 more element
Dependencies are inferred from the claim text.