Electrospun film, method for manufacturing the same and use of such electrospun film

Abstract

The invention provides an enhanced electrospun film made from polyvinylidene fluoride (PVDF) and at least one low-melting-point polymer in a ratio of 99.9:0.1-90:10 by weight, and the low-melting-point polymer having a melting point lower than the polyvinylidene fluoride and a softening point in the range of 110-140° C. The enhanced electrospun film exhibits excellent mechanical properties, higher moisture permeability and hydrostatic pressure resistance. The invention further provides a method for manufacturing the enhanced PVDF electrospun film, and use of the enhanced PVDF electrospun film in preparing a waterproof and moisture permeable product.

Dependencies are inferred from the claim text.